Question
Defects that can arise in this process include non-wet open and head-on-pillow. The 853D and 926LED-III are among the devices made by Yihua for performing this action, which is also what the American company Hakko makes tools for. A ball grid array design contains many namesake balls or bumps that this process is applied to. The “dip” and “wave” types of this process involve dipping certain parts in a bath. This action can be undone with a rework gun or a pump-like device called a namesake (*) “sucker”. “Stations” used for this action often include a wire mesh or sponge for cleaning tips. “Cold joints” may arise from improperly performing this action, which uses a lower temperature than the similar processes of brazing and welding. For 10 points, a namesake iron is used for what process of melting a lead or tin alloy to join electrical components? ■END■
Buzzes
Summary
| Tournament | Edition | Exact Match? | TUH | Conv. % | Power % | Neg % | Average Buzz |
|---|---|---|---|---|---|---|---|
| EMACS at CO | 08/06/2023 | Y | 4 | 75% | 25% | 25% | 76.33 |
| EMACS Online | 10/01/2023 | Y | 5 | 100% | 40% | 20% | 89.40 |